MEDIATEK: A Learning Environment for Technological Distance TrainingTILLEY · European Journal of Engineering Education1993PDF355 KB
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fine-Pitch Interconnection and Highly Integrated Assembly Packaging with FOMIP (Fan-out Mediatek Innovation Package) TechnologyHsu2020PDF690 KB
2016 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) - MiraVisionTM SmartScreen - MediaTek's Approach to Power Saving for DisplaysChen2016PDF527 KB
