About this scholarly article

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Fine-Pitch Interconnection and Highly Integrated Assembly Packaging with FOMIP (Fan-out Mediatek Innovation Package) Technology by Hsu, Ian; Chen, Chi-Yuan; Lin, Stanley; Yu, Ta-Jen; Hsieh, Ming-Che; Kang, KeonTaek; Yoon, Seung Wook is a scholarly article available to read on EtoBox.

Author

Hsu, Ian; Chen, Chi-Yuan; Lin, Stanley; Yu, Ta-Jen; Hsieh, Ming-Che; Kang, KeonTaek; Yoon, Seung Wook

Publisher

IEEE

Published

2020