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Can I read Advanced Materials for Thermal Management of Electronic Packaging Volume 30 || on EtoBox?
Advanced Materials for Thermal Management of Electronic Packaging Volume 30 || by Xingcun Colin Tong (auth.) is a engineering available to read on EtoBox.
What is Advanced Materials for Thermal Management of Electronic Packaging Volume 30 || about?
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This
Who reads Advanced Materials for Thermal Management of Electronic Packaging Volume 30 ||?
It is typically read by working professionals who need an authoritative practice reference.
Common subject areas: medicine, law, business, engineering.
- Author
- Xingcun Colin Tong (auth.)
- Publisher
- Springer New York : Imprint: Springer
- Published
- 2011
- Language
- EN
- ISBN
- 9781461427926
- Category
- engineering
- Subjects
- Engineering, Science, Technology & Engineering
- Updated
- 2026-03-25
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