Opening book details…
Can I read Thermal Management Materials for Electronic Packaging : Preparation, Characterization, and Devices on EtoBox?
Thermal Management Materials for Electronic Packaging : Preparation, Characterization, and Devices by Xingyou Tian (editor) is a engineering available to read on EtoBox.
What is Thermal Management Materials for Electronic Packaging : Preparation, Characterization, and Devices about?
<b>Thermal Management Materials for Electronic Packaging</b> <p><b>Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging</b> <p><i>Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices </i>provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the prep
Who reads Thermal Management Materials for Electronic Packaging : Preparation, Characterization, and Devices?
It is typically read by working professionals who need an authoritative practice reference.
Common subject areas: medicine, law, business, engineering.
- Author
- Xingyou Tian (editor)
- Publisher
- Wiley-VCH GmbH
- Published
- 2023
- Language
- EN
- ISBN
- 9783527843114
- Category
- engineering
- Subjects
- Science, Chemistry, Engineering
- Updated
- 2026-03-25
More by Xingyou Tian (editor)
Browse all works by Xingyou Tian (editor)
Similar books
- Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics Book 30) — Xingcun Colin Tong (auth.) (2011)
- Thermal Management for Opto-electronics Packaging and Applications — Xiaobing Luo, Run Hu, Bin Xie (2024)
- Graphene: Properties, Preparation, Characterisation and Devices (Woodhead Publishing Series in Electronic and Optical Materials) — Viera Skákalová; Alan B Kaiser; Elsevier (Amsterdam) (2014)
- Electrical Characterization of Organic Electronic Materials and Devices — Professor Peter Stallinga (2009)
- Thermal Management Handbook : for Electronic Assemblies — Jerry E Sergent; Al Krum; International Microelectronics and Packaging Society (1998)
- Electronic Packaging Materials and Their Properties (Electronic Packaging Series) — Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan (1999)