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Electronics Reliability and Measurement Technology : Nondestructive Evaluation by Joseph S. Heyman (Eds.) is a nonfiction available to read on EtoBox.
What is Electronics Reliability and Measurement Technology : Nondestructive Evaluation about?
Content: Foreword , Page v Preface , Pages vii-viii , Joseph A. Heyman - Executive summary of findings and recommendations , Pages 1-6 Measurement science and manufacturing science research , Pages 7-16 , D. Howard Phillips Nondestructive SEM for surface and subsurface wafer imaging , Pages 17-33 , Roy H. Propst, C. Robert Bagnell, Edward I. Cole Jr., Brian G. Davies, Frank A. DiBianca, Darryl G. Johnson, William V. Oxford, Craig A. Smith Surface inspection-research and development , Pages 34-36 , J.S. Batchelder - Sensors developed for in-process thermal sensing and imaging , Pages 37-41 , I.H. Choi, K.D. Wise Wafer level reliability for high-performance VLSI design , Pages 42-54 , Bryan J. Root, James D. Seefeldt Wafer level reliability testing: An idea whose time has come , Pages 55-59 , O.D. Trapp Micro-focus X-ray imaging , Pages 60-67 , Michael Juha Measurement of opaque film thickness , Pages 68-78 , R.L. Thomas, J. Jaarin, C. Reyes, I.C. Oppenheim, L.D. Favro, P.K. Kuo Intelligent laser soldering inspection and process control , Pages 79-88 , Riccardo Vanzetti Rupture testing for the quality control of electrodeposited copper interconnect
Who reads Electronics Reliability and Measurement Technology : Nondestructive Evaluation?
It is typically read by self-directed learners exploring a subject in depth.
Common subject areas: history, science, philosophy, social sciences.
- Author
- Joseph S. Heyman (Eds.)
- Publisher
- Noyes Data Corporation/Noyes Publications
- Published
- 1988
- Language
- EN
- ISBN
- 9781282002289
- Category
- nonfiction
- Subjects
- Engineering, Mathematics, Technology
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