About this scholarly article

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) - Plasma deposited CF polymer films as ultra low k intermetal dielectric, film properties and application by Uhlig, M.; Bertz, A.; Werner, T.; Gessner, T. is a scholarly article available to read on EtoBox.

Author

Uhlig, M.; Bertz, A.; Werner, T.; Gessner, T.

Publisher

IEEE

Published

2001

Language

EN