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The 14th Nordic Laser Materials Processing Conference (NOLAMP 14th, 2013) by Alexander Kaplan; Hans Engström; Luleå tekniska universitet Avdelningen för produkt- och produktionsutveckling; Nordic Laser Materials Processing Conference; NOLAMP Conference; NOLAMP is a nonfiction available to read on EtoBox.

What is The 14th Nordic Laser Materials Processing Conference (NOLAMP 14th, 2013) about?

Gothenburg, Sweden, August 26-28, 2013, 423 pages. Edited by Alexander Kaplan and Hans Engström. Preface The NOLAMP conferences address all aspects of laser materials processing from fundamental science to industrial applications. The first NOLAMP conference took place in Oslo in 1987 in a period of intense development of the laser processes and their industrial applications. The NOLAMP has continued on a biannual cycle ever since, strengthening the Nordic laser community by encouraging knowledge transfer and networking. Now, 26 years later, in the forthcoming 14th NOLAMP, the research and development of processes like laser welding, laser hybrid welding, laser cutting and laser surface treatment is still very important, as well as the development of industrial applications and equipment for laser material processing. CONTENTS Laser Welding - Session 1 Laser Welding - Session 2 Laser Additive Manufacturing Laser Cutting Laser Welding Session 3 Laser Hybrid Welding - Session 1 Laser Hybrid Welding - Session 2 Industrial Session - Laser Welding and Cutting Equipment - Session 1 Laser Surface Treatment Equipment - Session 2 Equipment - Session 3 Laser Welding - Session 4

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Common subject areas: history, science, philosophy, social sciences.

Author
Alexander Kaplan; Hans Engström; Luleå tekniska universitet Avdelningen för produkt- och produktionsutveckling; Nordic Laser Materials Processing Conference; NOLAMP Conference; NOLAMP
Publisher
Luleå University of Technology, Department of Engineering Sciences and Mathematics, Division of Product and Production Development
Published
2013
Language
EN
ISBN
9789174396898
Category
nonfiction
Subjects
Science, International Conferences And Symposiums, Stem

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