About this scholarly article

2016 6th Electronic System-Integration Technology Conference (ESTC) - Improved performance of flexible CMOS technology using ultimate thinning and transfer bonding by Dubois, E.; Philippe, J.; Berthome, M.; Robillard, J.F.; Gaquiere, C.; Danneville, F.; Gloria, D.; Raynaud, C. is a scholarly article available to read on EtoBox.

Author

Dubois, E.; Philippe, J.; Berthome, M.; Robillard, J.F.; Gaquiere, C.; Danneville, F.; Gloria, D.; Raynaud, C.

Publisher

IEEE

Published

2016