About this scholarly article

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Direct Bonding of low Temperature Heterogeneous Dielectrics by Iacovo, Serena; Peng, lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric is a scholarly article available to read on EtoBox.

Author

Iacovo, Serena; Peng, lan; Phommahaxay, Alain; Inoue, Fumihiro; Verdonck, Patrick; Kim, Soon-Wook; Sleeckx, Erik; Miller, Andy; Beyer, Gerald; Beyne, Eric

Publisher

IEEE

Published

2019