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The document discusses the use of structured glass substrates in wafer- and panel-level packaging, highlighting their advantages such as high precision, thermal expansion adjustments, and excellent dielectric properties. It reviews the current status of industrial readiness for glass packaging, emphasizing the need for standardization and efficient manufacturing processes. The authors present their contributions towards achieving this readiness, including the FLEXINITY® technology for cut-outs and through g

Author

Jugal

Language

EN