About this scholarly article

IEEE Technical Digest on Solid-State Sensor and Actuator Workshop - Low-cost, high-volume packaging techniques for silicon sensors and actuators by Mallon, J.; Bryzek, J.; Ramsey, J.; Tomblin, G.; Pourahmadi, F. is a scholarly article available to read on EtoBox.

Author

Mallon, J.; Bryzek, J.; Ramsey, J.; Tomblin, G.; Pourahmadi, F.

Publisher

IEEE

Published

1988