Opening book details…
Can I read Low-stress 3D Packaging of a Microsystem on EtoBox?
Low-stress 3D Packaging of a Microsystem by A. Morrissey; G. Kelly; J. Alderman is a Engineering article available to read on EtoBox.
What is Low-stress 3D Packaging of a Microsystem about?
The field of microsystems has in recent years attracted huge interest. Advances in micromachining have allowed the development of microfluidic components such as pumps, valves and flow channels. However, the packaging of microsystems, particularly microsensors, has proven one of the biggest limitations to their commercialization. This paper describes the 3D packaging of a rnicrosysrem demonstrator with sensor applications from the Esprit project BARMINT. Central to the operation of the 3D demonsnator is a micromachined siliconmembrane pump to supply fluids to a sensor chamber over a universal sensor chip carrying ISFET-based chemical sensors, pressure and thermal sensors. The electronics required for controlling and regulating the activity of the sensors is also available on this chip and as other chips within the assembly, which also contains a power-supply module. Costs are minimized by use of standard off-the-shelf components. In addition, consideration is given to the need to minimize packaging-induced stresses on the delicate membranes and structures involved in the system, and the packaging approach described herein is compared, from a stress-minimization viewpoint, with prev
Who reads Low-stress 3D Packaging of a Microsystem?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- A. Morrissey; G. Kelly; J. Alderman
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0924-4247)
- Published
- 1998
- Language
- EN
- Field
- Engineering (Physical Sciences)