About this scholarly article

2013 IEEE 63rd Electronic Components and Technology Conference - Assembly of 3D chip stack with 30μm-pitch micro interconnects using novel arrayed-particles anisotropic conductive film by Huang, Yu-Wei; Lin, Yu-Min; Zhan, Chau-Jie; Lu, Su-Tsai; Huang, Shin-Yi; Juang, Jing-Ye; Fan, Chia-Wen; Chung, Su-Ching; Peng, Jon-Shiou; Chen, Su-Mei; Lu, Yu-Lan; Chang, Pai-Cheng; Lau, John H. is a scholarly article available to read on EtoBox.

Author

Huang, Yu-Wei; Lin, Yu-Min; Zhan, Chau-Jie; Lu, Su-Tsai; Huang, Shin-Yi; Juang, Jing-Ye; Fan, Chia-Wen; Chung, Su-Ching; Peng, Jon-Shiou; Chen, Su-Mei; Lu, Yu-Lan; Chang, Pai-Cheng; Lau, John H.

Publisher

IEEE

Published

2013