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This document compares optical and copper approaches for Thunderbolt interconnect technology. It discusses the challenges of miniaturizing components to fit inside cables while maintaining high data rates of 25.78 Gb/s. A BiCMOS process was used to integrate the optical transmitter circuitry into a small die area. The optical cable design was also optimized to withstand daily consumer use while preventing the fiber inside from breaking.

Author

vijila varghese

Language

EN