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About this Engineering article
Mathematical Modeling of Electroplating in High Aspect Ratio Through-Holes of Multilayer Printed Circuit Boards by Hazlebeck, David A. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Hazlebeck, David A.
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 1989
- Language
- EN
- Field
- Engineering (Physical Sciences)