About this scholarly article

AIP Conference Proceedings - Thermal Stresses Analysis of 3-D Interconnect by Lu, Kuan H.; Zhang, Xuefeng; Ryu, Suk-Kyu; Huang, Rui; Ho, Paul S.; Ho, Paul S.; Zschech, Ehrenfried; Ogawa, Shinichi is a scholarly article available to read on EtoBox.

Author

Lu, Kuan H.; Zhang, Xuefeng; Ryu, Suk-Kyu; Huang, Rui; Ho, Paul S.; Ho, Paul S.; Zschech, Ehrenfried; Ogawa, Shinichi

Publisher

AIP

Published

2009

Language

EN