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About this Engineering article
Interfacial Microstructure and Carrier Conduction Process in Pt/Ti Ohmic Contact to P-In0.53Ga0.47As Formed by Rapid Thermal Processing by Chu, S.N.G.; Katz, A.; Boone, T.; Thomas, P.M.; Riggs, V.G.; Dautremont-Smith, W.C.; Johnson, W.D. is a Engineering article available to read on EtoBox.
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- Author
- Chu, S.N.G.; Katz, A.; Boone, T.; Thomas, P.M.; Riggs, V.G.; Dautremont-Smith, W.C.; Johnson, W.D.
- Publisher
- Cambridge University Press; Cambridge University Press (Materials Research Society); Cambridge University Press (CUP) (ISSN 0272-9172)
- Published
- 1990
- Language
- EN
- Field
- Engineering (Physical Sciences)