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Efficient design practices for thermal management of a TSV based 3D IC system by Zongwu Tang is a scholarly article available to read on EtoBox.

What is Efficient design practices for thermal management of a TSV based 3D IC system about?

Peak temperature, local hotspots, and thermal gradients became critical issues with higher localized current densities resulting from the combination of higher performance and further device miniaturization. 3D vertical integration utilizing VIA first/VIA early technologies exacerbated that problem by the interaction of inter-die heat sources and three-dimensional thermal gradients. One of the main proposed solutions for managing thermal issues in TSV based 3D integrated chips is the use of Thermal TSVs. In this talk I will cover the basics of the thermal issues with transition from 2D to 3D integration. Then I will focus on good first order design practices that will enable the designer using basic thermal simulations, physics based common sense, and some basic rules of thumb to avoid unacceptable thermal gradients in his/her 3D TSV based placement and integration.

Author

Zongwu Tang

Publisher

ACM

Published

2010

Language

EN