About this scholarly article

AIP Conference Proceedings [AIP Publishing APPLIED PHYSICS OF CONDENSED MATTER (APCOM 2019) - Strbske Pleso, Slovak Republic (19–21 June 2019)] APPLIED PHYSICS OF CONDENSED MATTER (APCOM 2019) - Dynamic FSI simulation of pin transfer process for solder paste transport by Tung, L. H.; Mukhtar, M. A. Fatah M.; Abas, A.; Azman, A.; Ng, F. C.; Nashrudin, M. N.; Samsudin, Z. is a scholarly article available to read on EtoBox.

Author

Tung, L. H.; Mukhtar, M. A. Fatah M.; Abas, A.; Azman, A.; Ng, F. C.; Nashrudin, M. N.; Samsudin, Z.

Publisher

AIP Publishing

Published

2019