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This document discusses various metal layer preparation methods for PCB manufacturing, including electroless plating, galvanic plating, and immersion plating. Electroless plating involves chemical reduction reactions to apply thin metal coatings to insulating surfaces, and is used for processes like hole metallization. Galvanic plating applies thicker metal layers through electrolytic reactions and requires a conductive surface. Common metal coatings include copper, nickel, silver, and gold. The document al

Author

dany

Language

EN