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Fabrication of Copper Electrode on Flexible Substrate Through Ag+-Based Inkjet Printing and Rapid Electroless Metallization by Cai, Wen-Ran; Chen, Yan-Qiu; Liu, Yu; Jin, Xiong; Deng, Yong-Qiang; Zhang, Yong-Zhe; Zhang, Jie; Yan, Hui; Gao, Wei-Lian; Mei, Jun; Lau, Woon-Ming is a Engineering article available to read on EtoBox.

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Author
Cai, Wen-Ran; Chen, Yan-Qiu; Liu, Yu; Jin, Xiong; Deng, Yong-Qiang; Zhang, Yong-Zhe; Zhang, Jie; Yan, Hui; Gao, Wei-Lian; Mei, Jun; Lau, Woon-Ming
Publisher
Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
Published
2017
Field
Engineering (Physical Sciences)

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Browse all works by Cai, Wen-Ran; Chen, Yan-Qiu; Liu, Yu; Jin, Xiong; Deng, Yong-Qiang; Zhang, Yong-Zhe; Zhang, Jie; Yan, Hui; Gao, Wei-Lian; Mei, Jun; Lau, Woon-Ming