About this scholarly article

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Novel anisotropic conductive adhesive for 3D stacking and lead-free PCB packaging — A review by Ramkumar, S. Manian; Venugopalan, Hari; Khanna, Kumar is a scholarly article available to read on EtoBox.

Author

Ramkumar, S. Manian; Venugopalan, Hari; Khanna, Kumar

Publisher

IEEE

Published

2011

Language

EN