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Can I read Top‐Down Meets Bottom‐Up: Dip‐Pen Nanolithography and DNA‐Directed Assembly of Nanoscale Electrical Circuits on EtoBox?
Top‐Down Meets Bottom‐Up: Dip‐Pen Nanolithography and DNA‐Directed Assembly of Nanoscale Electrical Circuits by Sung‐Wook Chung; David S. Ginger; Mark W. Morales; Zhengfan Zhang; Venkat Chandrasekhar; Mark A. Ratner; Chad A. Mirkin is a Engineering article available to read on EtoBox.
What is Top‐Down Meets Bottom‐Up: Dip‐Pen Nanolithography and DNA‐Directed Assembly of Nanoscale Electrical Circuits about?
Contributed equally to this work. [\*\*] We would like to thank Drs. Jwa-Min Nam and Shad Thaxton for their initial help in preparing oligonucleotide-modified Au nanoparticles. We would like to thank Dr.
Who reads Top‐Down Meets Bottom‐Up: Dip‐Pen Nanolithography and DNA‐Directed Assembly of Nanoscale Electrical Circuits?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Sung‐Wook Chung; David S. Ginger; Mark W. Morales; Zhengfan Zhang; Venkat Chandrasekhar; Mark A. Ratner; Chad A. Mirkin
- Publisher
- John Wiley and Sons; Wiley (John Wiley & Sons); Wiley - V C H Verlag GmbbH & Co.; Publons; Wiley (ISSN 1613-6810)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)