About this document
芯片堆叠封装耐湿热可靠性 唐宇 by ZhangJiayong is a document available to read on EtoBox.
The document discusses the reliability of a stacked dice package module in a hygrothermal environment (85°C / RH85%) over periods of 168 hours, utilizing simulations and experiments to analyze moisture absorption and stress distributions. Results indicate that the adhesive layers within the package exhibit lower moisture absorption rates compared to epoxy molding compounds, leading to significant hygro-thermo-mechanical stress at specific locations during the reflow process. The findings reveal interface cr
- Author
- ZhangJiayong
- Language
- EN