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What is New Generation CMP Equipment and Its Impact On IC Devices about?

This document discusses advancements in new generation CMP equipment, specifically the MIRRA® CMP equipment, which enhances the fabrication of various IC devices through improved polishing processes. Key innovations include a new polishing head design, an advanced endpoint system, and a new disk/pad conditioner that collectively improve process performance, reduce defect density, and increase tool availability. The results demonstrate significant improvements in polishing efficiency and reliability, making

Author

fboy22237

Language

EN