About this scholarly article

Low-Pressure-Assisted Large-Area (>800 mm 2 ) Sintered-Silver Bonding for High-Power Electronic Packaging by Tan, Yan-Song; Li, Xin; Chen, Xu; Lu, Guo-Quan; Mei, Yun-Hui is a scholarly article available to read on EtoBox.

Author

Tan, Yan-Song; Li, Xin; Chen, Xu; Lu, Guo-Quan; Mei, Yun-Hui

Publisher

Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)

Published

2018

Language

EN