About this scholarly article

Twenty Fourth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.99CH36330) - Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls by Seungyoung Ahn, ; Woonghwan Ryu, ; Myung-Jin Yim, ; Junho Lee, ; Young-Doo Jeon, ; Woopoung Kim, ; Kyung-Wook Paik, ; Joungho Kim, is a scholarly article available to read on EtoBox.

Author

Seungyoung Ahn, ; Woonghwan Ryu, ; Myung-Jin Yim, ; Junho Lee, ; Young-Doo Jeon, ; Woopoung Kim, ; Kyung-Wook Paik, ; Joungho Kim,

Publisher

IEEE

Published

1999

Language

EN