About this scholarly article

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) - Integration of a low stress photopatternable silicone into a wafer level package by Gardner, G.; Harkness, B.; Ohare, E.; Meynen, H.; Bulcke, M.V.; Gonzalez, M.; Beyne, E. is a scholarly article available to read on EtoBox.

Author

Gardner, G.; Harkness, B.; Ohare, E.; Meynen, H.; Bulcke, M.V.; Gonzalez, M.; Beyne, E.

Publisher

IEEE

Published

2004

Language

EN