About this scholarly article

2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Interfacial Crack Initiation and Delamination Propagation in Cu-filled TSV Structure by Incorporating Cohesive Zone Model and Finite Element Method by Fei, Jiu-Bin; Xu, Tao; Zhou, Jie-Ying; Ke, Chang-Bo; Zhang, Xin-Ping is a scholarly article available to read on EtoBox.

Author

Fei, Jiu-Bin; Xu, Tao; Zhou, Jie-Ying; Ke, Chang-Bo; Zhang, Xin-Ping

Publisher

IEEE

Published

2020