About this scholarly article

2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Hetero-connecting materials effect on the electromigration and thermalmigration of SnBi solder joints by Liu, Ming; Ma, Limin; Guo, Fu; Wang, Yishu; Han, Jing is a scholarly article available to read on EtoBox.

Author

Liu, Ming; Ma, Limin; Guo, Fu; Wang, Yishu; Han, Jing

Publisher

IEEE

Published

2018