About this scholarly article

2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - DSM Reballing Ball Height Prediction Model by Liu, Chao-Wei; Wu, Shang-Lin; Chen, Ming-Hung; Yeh, Chang-Lin; Pi, Tun-Ching; Kao, Jen-Chieh is a scholarly article available to read on EtoBox.

Author

Liu, Chao-Wei; Wu, Shang-Lin; Chen, Ming-Hung; Yeh, Chang-Lin; Pi, Tun-Ching; Kao, Jen-Chieh

Publisher

IEEE

Published

2020