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About this Engineering article
Electromigration-induced Bond Improvement for Three-dimensional Integrated Circuits by Leong, H. L.; Gan, C. L.; Thompson, C. V.; Pey, K. L.; Li, H. Y. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Leong, H. L.; Gan, C. L.; Thompson, C. V.; Pey, K. L.; Li, H. Y.
- Publisher
- American Institute of Physics; AIP Publishing (ISSN 0003-6951)
- Published
- 2009
- Field
- Engineering (Physical Sciences)
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