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About this Engineering article
Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness by Yang, C.-C.; Baumann, F.; Wang, P.-C.; Lee, S.Y.; Ma, P.; AuBuchon, J.; Edelstein, D. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yang, C.-C.; Baumann, F.; Wang, P.-C.; Lee, S.Y.; Ma, P.; AuBuchon, J.; Edelstein, D.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0167-9317)
- Published
- 2013
- Field
- Engineering (Physical Sciences)