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The document discusses an investigation into the wetting behavior of copper on tungsten carbide surfaces at 1080°C in vacuum. Three substrate types were tested: commercial WC-Co with 3.5% cobalt, a WC thin film sputter deposited on WC-Co, and WC produced by hot pressing. Contact angles were measured and related to wettability, with the lowest angle and best wettability found for WC-Co and the highest angle and worst wettability for WC.

Author

hans

Language

EN