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About this Engineering article
Special issue/Three-dimensional molded circuit boards. MCB of inmold transfer method. by OHMORI, Kazumitsu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- OHMORI, Kazumitsu
- Publisher
- Japan Science and Technology Information Aggregator, Electronic; The Surface Finishing Society of Japan; Surface Financing Society of Japan/Hyomen Gijutus Kyokai (ISSN 0915-1869)
- Published
- 1990
- Field
- Engineering (Physical Sciences)