About this scholarly article

2012 4th Electronic System-Integration Technology Conference - Reducing the bond frame width in Cu/Sn SLID wafer level packaging by Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut E.; Hoivik, Nils is a scholarly article available to read on EtoBox.

Author

Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut E.; Hoivik, Nils

Publisher

IEEE

Published

2012

Language

EN