About this scholarly article

2012 14th International Conference on Electronic Materials and Packaging (EMAP) - Current stressing effects on interfacial reaction characteristics of fine-pitch microbump by Jong-Myeong Park, ; Jong-Jin Park, ; Sung-Hyuk Kim, ; Park, Young-Bae is a scholarly article available to read on EtoBox.

Author

Jong-Myeong Park, ; Jong-Jin Park, ; Sung-Hyuk Kim, ; Park, Young-Bae

Publisher

IEEE

Published

2012

Language

EN