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NEPCON ASIA 2023: PCBA & IC Packaging by Leonardo Crespo is a document available to read on EtoBox.

What is NEPCON ASIA 2023: PCBA & IC Packaging about?

NEPCON ASIA 2023 will take place from October 11-13 at the Shenzhen World Exhibition & Convention Center, focusing on PCBA and IC packaging within the electronics manufacturing industry. The event will feature 1,200 exhibitors, 60,000 expected attendees, and over 30 concurrent events, promoting cross-border business opportunities and showcasing advanced technology solutions. It aims to enhance the global competitiveness of Asian electronics manufacturers by fostering cooperation across various sectors inclu

Author

Leonardo Crespo

Language

EN