About this scholarly article

International Electron Devices Meeting. IEDM Technical Digest - RF MOSFET modeling accounting for distributed substrate and channel resistances with emphasis on the BSIM3v3 SPICE model by Liu, W.; Gharpurey, R.; Chang, M.C.; Erdogan, U.; Aggarwal, R.; Mattia, J.P. is a scholarly article available to read on EtoBox.

Author

Liu, W.; Gharpurey, R.; Chang, M.C.; Erdogan, U.; Aggarwal, R.; Mattia, J.P.

Publisher

IEEE

Published

1997

Language

EN