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What is ZnO Nanoparticles Enhance Sn-Sb-Cu Solder about?

The document discusses the influence of adding ZnO nano-particles to a Sn-5.0 wt% Sb-0.5 wt% Cu lead-free solder alloy. Differential scanning calorimetry showed a slight increase in melting temperature after ZnO addition. X-ray diffraction and scanning electron microscopy revealed a homogeneous distribution and refinement of intermetallic compounds and tin grains in the composite solder. Tensile tests indicated that adding ZnO enhanced the yield stress and ultimate tensile strength while reducing ductility

Author

Eidelsayed

Language

EN