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Novel Microstructures for Theinsitumeasurement of Mechanical Properties of Thin Films by Mehran Mehregany; Roger T. Howe; Stephen D. Senturia is a Physics and Astronomy article available to read on EtoBox.

What is Novel Microstructures for Theinsitumeasurement of Mechanical Properties of Thin Films about?

This paper discusses microfabricated structures designed for the in situ measurement of the mechanical properties of thin films under residual tensile stress. The film is deposited and patterned on a (100) silicon substrate in which 5-flm-thick diaphragms have been fabricated. When the silicon diaphragm is etched from the backside in an SF 6 plasma, the microstructures are released and deform under the residual tension. Measurement of this deformation in conjunction with appropriate mechanical models determines the mechanical properties of interest. We have used these structures to study benzophenonetetracarboxylicdianhidrideoxydianiline/metaphenylene-diamine polyimide films. Typical value for the residual stress to modulus ratio in this case was determined to be 0.011 ± 0.001 while the ultimate strain at break was found to be 4.5% for 5.5-,um-thick films. For thicker films (8.5 flm), the film did not fail until 8% strain was reached.

Who reads Novel Microstructures for Theinsitumeasurement of Mechanical Properties of Thin Films?

Author

Mehran Mehregany; Roger T. Howe; Stephen D. Senturia

Publisher

American Institute of Physics; AIP Publishing; Publons (ISSN 0021-8979)

Published

1987

Language

EN

Field

Physics and Astronomy (Physical Sciences)