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Can I read Development of a Double Sided Stitching Interferometer for Wafer Characterization on EtoBox?
Development of a Double Sided Stitching Interferometer for Wafer Characterization by M. Jansen; P. Schellekens; H. Haitjema is a Engineering article available to read on EtoBox.
What is Development of a Double Sided Stitching Interferometer for Wafer Characterization about?
A pre-prototype measurement machine for measuring the geometry of double side polished wafers has been developed. The measurement principle is based on a scanning double sided Fizeau interferometer with which the front side and the back side flatness of a wafer are measured simultaneously. Both flatness maps are used to derive the wafer thickness variation. Field distortion of the optical system, alignment errors and the thickness variations of the reference cavity are compensated by self-calibrating techniques in order to achieve a measurement uncertainty in the order of several nanometers.
Who reads Development of a Double Sided Stitching Interferometer for Wafer Characterization?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- M. Jansen; P. Schellekens; H. Haitjema
- Publisher
- International Academy for Production Engineering; Elsevier ; Elsevier USA; Elsevier BV (ISSN 0007-8506)
- Published
- 2006
- Language
- EN
- Field
- Engineering (Physical Sciences)