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What is Thermal Expansion in TSV Structures about?

The document discusses the thermal expansion behavior of through-silicon-via (TSV) structures in 3D microelectronic packaging, highlighting the challenges posed by thermal expansion mismatch between copper and silicon. It emphasizes the importance of optimizing TSV design, including size, material choice, and distribution, to minimize thermal stresses and prevent device failure. The findings suggest that a lower copper volume fraction leads to reduced thermal mismatch and stress, enhancing overall device re

Author

Shweta

Language

EN