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About this Engineering article
Ranking Process Parameter Association with Low Yield Wafers Using Spec-out Event Network Analysis by Yang, Jiwon; Lee, Seungkyung; Kang, Seokho; Cho, Sungzoon; Lee, Younghak; Park, Haesang is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yang, Jiwon; Lee, Seungkyung; Kang, Seokho; Cho, Sungzoon; Lee, Younghak; Park, Haesang
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0360-8352)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)