About this scholarly article

2008 58th Electronic Components and Technology Conference - Application of through mold via (TMV) as PoP base package by Jinseong Kim, ; Kiwook Lee, ; Dongjoo Park, ; Taekyung Hwang, ; Kwangho Kim, ; Daebyoung Kang, ; Jaedong Kim, ; Choonheung Lee, ; Scanlan, Christopher; Berry, CJ; Zwenger, Curtis; Lee Smith, ; Dreiza, Moody; Darveaux, Robert is a scholarly article available to read on EtoBox.

Author

Jinseong Kim, ; Kiwook Lee, ; Dongjoo Park, ; Taekyung Hwang, ; Kwangho Kim, ; Daebyoung Kang, ; Jaedong Kim, ; Choonheung Lee, ; Scanlan, Christopher; Berry, CJ; Zwenger, Curtis; Lee Smith, ; Dreiza, Moody; Darveaux, Robert

Publisher

IEEE

Published

2008