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Can I read Aging of solder connection to Ti-Pd-Au films: Peter M. Hall and Lloyd W. Condra IEEE Trans. Components, Hybrids, Mfg Technol. Chmt-2, (3) 279 (September 1979) on EtoBox?
Aging of solder connection to Ti-Pd-Au films: Peter M. Hall and Lloyd W. Condra IEEE Trans. Components, Hybrids, Mfg Technol. Chmt-2, (3) 279 (September 1979) is a Engineering article available to read on EtoBox.
What is Aging of solder connection to Ti-Pd-Au films: Peter M. Hall and Lloyd W. Condra IEEE Trans. Components, Hybrids, Mfg Technol. Chmt-2, (3) 279 (September 1979) about?
A general survey of the technology of epitaxy and its application to silicon devices. The more common deposition techniques are described and compared in respect of their application to present day devices. An extensive bibliography is given. Aging of solder connection to Ti-Pd-Au films
Who reads Aging of solder connection to Ti-Pd-Au films: Peter M. Hall and Lloyd W. Condra IEEE Trans. Components, Hybrids, Mfg Technol. Chmt-2, (3) 279 (September 1979)?
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier Ltd; Elsevier BV (ISSN 0026-2692)
- Published
- 1981
- Language
- EN
- Field
- Engineering (Physical Sciences)