Opening book details…
About this Engineering article
Thermal Analysis of a New High Density Package Cooling Technology Using Low Melting Point Alloys by Y. Fukuoka; M. Ishizuka is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Y. Fukuoka; M. Ishizuka
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 1991
- Field
- Engineering (Physical Sciences)