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Palladium-Free Cu Plating on ABS Plastic by labo is a document available to read on EtoBox.

What is Palladium-Free Cu Plating on ABS Plastic about?

This document presents a new palladium-free surface activation process for electroless copper plating on ABS plastic, utilizing an environmentally friendly etching method with H2SO4-MnO2 colloid. The study investigates the effects of various parameters on the adhesion strength of the deposited copper film, demonstrating that nickel particles can effectively replace palladium as a catalyst for the plating process. Results indicate that this method allows for full surface coverage of copper on ABS within a sh

Author
labo
Language
EN