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What is Palladium-Free Cu Plating on ABS Plastic about?
This document presents a new palladium-free surface activation process for electroless copper plating on ABS plastic, utilizing an environmentally friendly etching method with H2SO4-MnO2 colloid. The study investigates the effects of various parameters on the adhesion strength of the deposited copper film, demonstrating that nickel particles can effectively replace palladium as a catalyst for the plating process. Results indicate that this method allows for full surface coverage of copper on ABS within a sh
- Author
- labo
- Language
- EN