About this scholarly article

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - An improved PCM heat storage technology utilizing metal foam by Dukhan, Nihad; Bodke, Sujay is a scholarly article available to read on EtoBox.

Author

Dukhan, Nihad; Bodke, Sujay

Publisher

IEEE

Published

2010

Language

EN