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About this Engineering article
Development of Epoxy/BN Composites with High Thermal Conductivity for Metal-Core Printed Circuit Board (MCPCB) by Choi, Jae Hyun; Choi, Bong Goo; Lee, Min A.; Na, Jae Sik is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Choi, Jae Hyun; Choi, Bong Goo; Lee, Min A.; Na, Jae Sik
- Publisher
- Trans Tech Publications Inc.; Trans Tech Publications, Ltd.; Scitec Publications Ltd. (ISSN 1660-9336)
- Published
- 2015
- Field
- Engineering (Physical Sciences)
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